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| ICX085AL Diagonal 11mm (Type 2/3) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX085AL is a diagonal 11mm (Type 2/3) interline CCD solid-state image sensor with a square pixel array. Progressive scan allows all pixels signals to be output independently within approximately 1/12 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors. This chip is suitable for image input applications such as still cameras which require high resolution. V 20 pin DIP (Ceramic) Pin 1 1 Features * Progressive scan allows individual readout of the image signals from all pixels. * High vertical resolution (1024TV-lines) still image without a mechanical shutter. * Square pixel unit cell * Aspect ratio 5:4 * Horizontal drive frequency: 20.25MHz * Reset gate bias is not adjusted. * Substrate voltage: 5.5 to 12.5V * Continuous variable-speed shutter * High resolution, high sensitivity, low dark current * Low smear * Excellent antiblooming characteristics * Horizontal register: 5V drive 3 4 Pin 11 H 56 Optical black position (Top View) Device Structure * Interline CCD image sensor * Image size: Diagonal 11mm (Type 2/3) * Number of effective pixels: 1300 (H) x 1030 (V) approx. 1.3M pixels * Total number of pixels: 1360 (H) x 1034 (V) approx. 1.4M pixels * Chip size: 10.0mm (H) x 8.7mm (V) * Unit cell size: 6.7m (H) x 6.7m (V) * Optical black: Horizontal (H) direction: Front 4 pixels, rear 56 pixels Vertical (V) direction: Front 3 pixels, rear 1 pixel * Number of dummy bits: Horizontal 24 Vertical 1 * Substrate material: Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E95Z10D99 ICX085AL Block Diagram and Pin Configuration (Top View) GND VOUT GND GND CGG V1 V2 2 NC 10 9 8 7 6 5 4 3 Vertical register Note) Horizontal register Note) 11 12 13 14 15 16 17 18 19 20 : Photo sensor SUB VRD RG GND GND Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 Symbol V3 V2 V1 VL GND GND NC CGG GND VOUT Output amplifier gate1 GND Signal output Description Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Protective transistor bias GND GND Pin No. 11 12 13 14 15 16 17 18 19 20 Symbol VRD VDD GND SUB NC NC RG GND H1 H2 Reset gate clock GND Horizontal register transfer clock Horizontal register transfer clock Description Reset drain power supply Supply voltage GND Substrate (overflow drain) 1 DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1F or more. VDD -2- H1 H2 NC NC V3 1 VL ICX085AL Absolute Maximum Ratings Item Substrate voltage SUB-GND Supply voltage Vertical clock input voltage VDD, VOUT, VRD, CGG-GND VDD, VOUT, VRD, CGG-SUB V1, V2, V3-GND V1, V2, V3-SUB Ratings -0.3 to +55 -0.3 to +18 -55 to +9 -15 to +16 to +10 to +15 to +16 -16 to +16 -10 to +15 -55 to +10 -65 to +0.3 -0.3 to +27.5 -0.3 to +20.5 -0.3 to +17.5 -30 to +80 -10 to +60 Unit V V V V V V V V V V V V V V C C 1 Remarks Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins H1, H2-V3 H1, H2-GND H1, H2-SUB VL-SUB V2, V3-VL RG-GND V1, H1, H2, GND-VL Storage temperature Operating temperature 1 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. -3- ICX085AL Bias Conditions Item Supply voltage Substrate voltage adjustment range Protective transistor bias DC Characteristics Item Supply current Symbol IDD Min. Typ. 6 Max. 8 Unit mA Remarks Symbol VDD VSUB VL Min. 14.55 5.5 2 Typ. 15.0 Max. 15.45 12.5 Unit V V 1 Remarks 1 Indications of substrate voltage (VSUB) setting value The setting value of the substrate voltage is indicated on the back of image sensor by a special code. Adjust the substrate voltage (VSUB) to the indicated voltage. VSUB code - two characters indication Integer portion Decimal portion Integer portion of code and optimal setting correspond to each other as follows. Integer portion of code Optimal setting A 5 C 6 d 7 E 8 f 9 G 10 h 11 J 12 ICX085AL Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor V1 R2 Symbol CV1 CV2, CV3 CV12 CV23 CV31 CH1 CH2 CHH Min. Typ. 5000 10000 1200 100 3300 82 68 22 Max. Unit pF pF pF pF pF pF pF pF Remarks CRG 6 pF CSUB R1, R2, R3 RGND RH1, RH2 RRG V2 800 30 30 10 20 pF R1 CV12 CV1 RGND CV2 RH1 H1 CHH RH2 H2 Cv31 CV3 Cv23 CH1 CH2 R3 V3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RRG RG CRG Reset gate clock equivalent circuit -5- ICX085AL Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% II II M M 2 tf 0V VVT 10% 0% tr twh (2) Vertical transfer clock waveform V1 VVHL VVH1 VVHH VVH VVLH VVL01 VVL1 VVLL V2 VVH02 VVHH VVHL VVH2 VVL VVH VVLH VVL2 VVLL V3 VVHL VVH3 VVL VVHH VVH VVL03 VVLL VVLH VVL VVH = VVH02 VVL = (VVL01 + VVL03) /2 VV1 = VVH1 - VVL01 VV2 = VVH02 - VVL2 VV3 = VVH3 - VVL03 -6- ICX085AL (3) Horizontal transfer clock waveform H1, H2 tr twh tf 90% VH 10% VHL twl (4) Reset gate clock waveform RG tr twh tf VRGH twl RG waveform Point A VRG VRGL + 0.5V VRGLH VRGL VRGLL H1 waveform 2.5V VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL) /2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL (5) Substrate clock waveform SUB 100% 90% M V SUB 10% 0% M 2 tf VSUB tr twh -7- ICX085AL Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock During imaging Symbol VT V1, V2, V3 H1 H2 15 16 18 19 15 15 19 18 6 6 0.01 0.01 7 8 37.9 2.5 0.5 10.6 10.6 twh twl tr tf Unit s 110 6 6 0.01 0.01 2.5 0.5 10.6 10.6 ns ns Remarks During readout 1 2 Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 4.6 5.0 0.5 52.5 0.5 During H1 parallel-serial H2 conversion RG SUB s ns s During drain charge Reset gate clock Substrate clock 1.8 2.1 1 When vertical transfer clock driver CXD1268M x 2 is used. 2 tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least 2.5V. two Item Horizontal transfer clock Symbol H1, H2 Min. Typ. Max. 13.0 15.5 Unit ns Remarks 3 3 The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. -8- ICX085AL Image Sensor Characteristics Item Sensitivity Saturation signal Smear Video signal shading Dark signal Dark signal shading Lag Symbol S Vsat Sm SH Vdt Vdt Lag Min. 1300 400 0.005 0.008 20 25 8 4 0.5 Typ. 1600 Max. (1/12 second accumulation mode, Ta = 25C) Unit mV mV % % % mV mV % Measurement method 1 2 3 4 4 5 6 7 Zone 0 and I Zone 0 to II' Ta = 60C Ta = 60C Ta = 60C Remarks Zone Definition of Video Signal Shading 1300 (H) 10 10 3 H 8 H 8 V 10 1030 (V) Zone 0, I Zone II, II' V 10 3 Ignored region Effective pixel region Measurement System CCD signal output [A] CCD C.D.S AMP S/H Signal output [B] Note) Adjust the amplifier gain so that the gain between [A] and [B] equals 1. -9- ICX085AL Image Sensor Characteristics Measurement Method Measurement conditions 1) In the following measurements, the substrate voltage is set to the value indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [B] of the measurement system. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0 mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0 mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/80s, measure the signal output (VS) at the center of the screen, and substitute the value into the following formula. S = VS x 80 [mV] 12 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mV, measure the minimum value of the signal output. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 150mV. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV]) of the signal output and substitute the value into the following formula. Sm = 1 VSm 1 x x x 100 [%] (1/10 V method conversion value) 10 150 500 - 10 - ICX085AL 4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 150mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax - Vmin)/150 x 100 [%] 5. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt=Vdmax - Vdmin [mV] 7. Lag Adjust the signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) x 100 [%] FLD SG Light Strobe light timing Signal output 150mV Output Vlag (Lag) - 11 - Drive Circuit 15V 100k 0.1 -7.5V 22/16V 5V 22/20V 2SK523 1/10V 2.7k 47 CXD1268M x2 0.1 22/10V XV2 XSG 1 2 N.C. 3 4 N.C. 5 6 7 N.C. 8 9 20 19 18 17 N.C. 16 15 14 N.C. 13 12 11 10 CCD OUT XV1 XV3 1 2345 6 7 8 9 10 VSUB XSUB 1/35V 22/16V 20 19 18 17 16 15 14 13 12 11 1M 3.3/20V 100k 3.3/16V 0.01 22/20V N.C. 1 2 3 4 5 6 7 N.C. 8 9 N.C. 10 20 N.C. 19 N.C. 18 17 16 15 N.C. 14 N.C. 13 12 N.C. 11 AC04 AC04 XH2 ICX085AL XH1 RG H2 H1 GND RG NC NC SUB GND VDD VRD 1/20V 0.01 - 12 - CXD1267AN V3 V2 V1 VL GND GND NC CGG GND VOUT ICX085 (BOTTOM VIEW) ICX085AL Spectral Sensitivity Characteristics (Includes lens characteristics, excludes light source characteristics) 1.0 0.9 0.8 0.7 Relative Response 0.6 0.5 0.4 0.3 0.2 0.1 0.0 400 500 600 700 Wave Length [nm] 800 900 1000 - 13 - Sensor Readout Clock Timing Chart HD 33.7s (683 bits) 5.0s (102 bits) 4.0s (81 bits) Normal-speed readout mode SG V1 V2 - 14 - 33.7s (683 bits) 5.0s (102 bits) 4.0s (81 bits) V3 Double-speed readout mode SG V1 V2 V3 ICX085AL Drive Timing Chart (Vertical Sync) Normal-speed readout mode VD HD 5 10 15 SG V1 V2 V3 1030 1031 12345 CCD OUT 1044 1 20 - 15 - ICX085AL Drive Timing Chart (Vertical Sync) Double-speed readout mode VD HD 1 5 15 SG - 16 - 1030 1031 1029 2246 131357 V1 V2 V3 CCD OUT 522 10 20 ICX085AL Drive Timing Chart (Horizontal Sync) Normal-speed readout mode HD CLK 297 321 326 H1 232 1 24 1 1616 1 H2 RG SHP - 17 - 57 1 19 1 1 1 38 1 1 167 42 1 57 57 SHD 65 1 65 1 V1 175 156 1 V2 V3 1 137 SUB 1 23 19 CCD OUT OPB (4 bits) OPB (56 bits) ICX085AL Drive Timing Chart (Horizontal Sync) Double-speed readout mode HD CLK 297 321 326 H1 232 1 24 1 1616 1 H2 RG SHP - 18 - 57 1 1 57 1 1 1 57 1 57 1 167 42 1 1 38 57 1 57 1 57 57 1 19 1 57 SHD V1 65 1 65 1 61 42 1 V2 V3 1 23 SUB 1 23 19 CCD OUT OPB (4 bits) OPB (56 bits) ICX085AL ICX085AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Operate in clean environments (around class 1000 is appropriate). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. 5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to too much mechanical shocks. - 19 - Package Outline Unit: mm 20pin DIP (800mil) 0 to 9 11 A D C 31.0 0.4 27.0 0.3 + 0.25 2-2.50 0 20 ~ ~ 2R3 .0 26.0 5.0 B + 0.15 2.00 0 (Reference Hole) 0.35 1. "A" is the center of the effective image sensor area. 2. A straight line "B" which passes through the centers of the reference hole and the elongated hole is the reference axis of vertical direction. 3. A straight line "C" which passes through the center of the reference hole at right angles to vertical reference line "B" is the reference axis of horizontal direction. 0.3 M 5.5 0.2 2.54 0.46 1.27 1.0 3.2 0.3 1Pin Index 4. The bottom "D" is the height reference. (Two points are specified.) 5. The center of the effective image area, specified relative to the reference hole is (H, V) = (13.15, 5.0) 0.15mm. 6. The angle of rotation relative to the reference line "B" is less than 1. 7. The height from the bottom "D" to the effective image area is 1.46 0.15mm. 8. Planar orientation of the effective image area relative to the bottom "D" is less than 60m. 9. The thickness of the cover glass is 0.75mm and the refractive index is 1.5. ICX085AL PACKAGE STRUCTURE PACKAGE MATERIAL Ceramic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE WEIGHT 5.9g 0.25 1 13.15 0.5 10 26.00 0.25 + 0.15 2.00 0 x 2.5 (Elongated Hole) (AT STAND OFF) H 20.2 0.3 V 20.32 - 20 - |
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